Leading industrial transformation with visual revolution
In the field of Mini/Micro LED new displays, the company will fully utilize and consolidate its R&D and technological advantages, accelerate the layout of key application areas such as direct display, backlight (VR), and automotive through strategies such as capacity expansion and management upgrades. The company's products adopt advanced fully inverted COB packaging technology, and it is one of the few enterprises in the world that has truly achieved large-scale mass production and sales of Mini LED products. It is committed to becoming a leading global provider of Mini/Micro LED semiconductor display devices and services.
Direct Display Series
Backlight series
Technical advantages
01
Consistent ink color
The three-dimensional structure packaging form fundamentally solves the problem of ink consistency;
02
Low failure rate
The packaging adopts unique innovative thermal pressure-sensitive technology;
Protect chip solder joints from water and oxygen corrosion.
03
Fine and delicate picture quality
Microchip of chip size, autonomous chip mixed BIN algorithm.
04
Zero seam
The process adopts a bridging ultra-high precision (precision controllable ± 5um) cutting mode.
05
Static consistency
Through collaborative upstream development, a new coating process and special formulated materials have been developed to increase side strength and airtightness, while also addressing static white lines and seam color deviation.
Hongping Series
Product specifications
P0.7-P1.5
COB packaging technology
Fully Inverted LED Chip
Ultra high ink consistency
Ultra high ink consistency, good ink consistency, no need to pick pieces for the same or multiple batches.
Ultra high contrast
Ultra high contrast, with a contrast ratio of 20000:1
Better near screen experience
Low temperature rise (600nit white screen)<18 ℃, better near screen experience.
Strong universality
Strong universality, modular universal design, no distinction between A/B boards, batch backup available.
High flexibility
High flexibility, pre installation/pre maintenance!
Hongyi Series
Large module, large "view" LVDS signal transmission, faster and more stable
The transmission speed is increased by more than 10 times.
Ultimate matte black, restoring the original color
Extremely matte black, non reflective screen.
Smart module, worry free throughout the entire process
The module supports open-circuit dead pixel detection, capable of detecting the number of dead pixels in red, green, and blue separately. It monitors module-level temperature and bit error rate in real-time, and can automatically send email alerts in case of anomalies.
Light as a swallow, thin as a cicada's wing
The product adopts a three in one highly integrated design of power supply, HUB board, and receiver card, simplifying complexity.
The thickness of the finished box is less than 30mm, and the weight of the finished box is approximately 3.5Kg per box.
7-fold protection, worry free and effortless
Waterproof, moisture-proof, dustproof, shockproof, anti-collision, anti-static, and anti-oxidation.
